Silicon on Ceramics

  • INCREASE FONT SIZE
  • DEFAULT FONT SIZE
  • DECREASE FONT SIZE
Start Research Key Benefits

Key Benefits

•    Increased substrate functionality by technology combination (MEMS & LTCC)
•    Reduced silicon requirement (only a thin silicon layer)
•    Reduced assembly effort   
•    Insulating carrier material
•    Chip assembling and connection before MEMS processing → no influence to micro- and nano elements
•    Zero-stress chip assembly → no intermediate layers/materials
•    Wafer-Level-Packaging (even for harsh environment)
•    Macro-Nano-Integration on one substrate